- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/508 - Bases; Cases composed of different pieces assembled by clip or spring
Patent holdings for IPC class H01R 13/508
Total number of patents in this class: 165
10-year publication summary
|
14
|
6
|
24
|
25
|
18
|
17
|
25
|
9
|
16
|
4
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| HARTING Electric GmbH & Co. KG | 437 |
13 |
| Molex, LLC | 1792 |
9 |
| Phoenix Contact GmbH & Co. KG | 2202 |
8 |
| Japan Aviation Electronics Industry, Limited | 1585 |
6 |
| Apple Inc. | 50209 |
5 |
| Sumitomo Wiring Systems, Ltd. | 9367 |
5 |
| CommScope Connectivity Belgium BVBA | 497 |
4 |
| Hirose Electric Co., Ltd. | 325 |
4 |
| Tyco Electronics Corporation | 792 |
3 |
| Dongguan Xuntao Electronic Co., Ltd. | 4 |
3 |
| Hosiden Corporation | 428 |
3 |
| Panduit Corp. | 1007 |
3 |
| TE Connectivity Germany GmbH | 655 |
3 |
| WAGO Verwaltungsgesellschaft mbH | 462 |
3 |
| Eaton Intelligent Power Limited | 6113 |
3 |
| Aptiv Technologies AG | 2097 |
3 |
| Intel Corporation | 45621 |
2 |
| Yazaki Corporation | 6282 |
2 |
| ZF Friedrichshafen AG | 6820 |
2 |
| Tyco Electronics Japan G.K. | 382 |
2 |
| Other owners | 79 |